Eaton liquid cooled enclosures and chassis act as both structural and thermal solutions by incorporating liquid flow paths within a mechanical structure. Chassis and enclosures can range from simple tube-bonded structures to highly complex internal geometries that optimize liquid contact area, flow rate and pressure drop.
A liquid cooled enclosure is a mechanical housing that doubles as a thermal management component. Rather than mounting separate cold plates inside the enclosure, liquid flow paths are built directly into the enclosure walls or base. This integrated approach removes heat from electronics at the source, reduces the number of components in the thermal system, and is well suited to applications where space, weight, or assembly complexity are constraints.
Eaton liquid cooled chassis are designed for high-density electronics in environments where air cooling is not sufficient. The liquid flow path within the chassis wall transfers heat from boards, processors and power electronics directly into the coolant, keeping component temperatures stable under sustained high loads. Common applications include data center server chassis, defense electronics enclosures, industrial control systems and aerospace equipment where a rugged liquid cooled enclosure is required. Fabrication options include aluminum die casting, dip brazing and vacuum brazing to suit different performance and environmental requirements.
Eaton liquid cooled enclosures and chassis are designed to integrate with the broader Eaton liquid cooling ecosystem, including liquid cold plates, liquid cooling loops, coolant distribution units (CDUs), and chillers. Using compatible components from a single supplier reduces integration time, simplifies thermal validation, and ensures the full system is designed to work together. Contact Boyd Thermal by Eaton to discuss a liquid cooling enclosure configured for your application.
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