Eaton pumped two-phase cooling systems are advanced cooling and heat transfer solutions utilizing a pump to circulate fluid that transitions between liquid and vapor phases within the system. Pumped-two phase cooling effectively manages and dissipates heat from diverse applications, particularly in high-performance cooling scenarios.
Pumped two-phase cooling merges the features of two-phase cooling and liquid cooling systems, combining the strengths of both cooling technologies. Two-phase cooling employs specialized cold plates to efficiently cool high power equipment by evaporating the working fluid for rapid heat removal from heat sources. The modified liquid system architecture pumps working fluid to reject absorbed heat with a heat exchanger. Coolant condenses, and the system pumps liquid back to the cold plates to repeat the process.
Our extensive experience in two-phase cooling and liquid cooling system technologies serves as a robust foundation for collaborative development. Our capacity to advance both two-phase cooling and liquid cooling systems empowers us to engineer cutting-edge solutions tailored to your specific needs.
Our comprehensive thermal technology portfolio seamlessly integrates liquid, two-phase and air-cooling innovations. As a proud participant in the U.S. Department of Energy (DOE) program called COOLERCHIPS, Boyd Thermal by Eaton is dedicated to advancing pioneering technologies that give rise to a new era of highly efficient and power-dense data centers through advanced liquid cooling system development. Our expertise and capabilities enable us to develop innovative liquid cold plates for advanced pumped two-phase systems, delivering energy-efficient and high-performance cooling solutions tailored to your specific applications.
Our advanced liquid cooling technology integrates two-phase cooling and liquid cooling systems as pumped two-phase systems, or evaporative liquid cooling, and harnesses the synergistic advantages of both technologies. Our expertise enables us to create cutting-edge cooling solutions tailored to the most demanding needs of high-performance chips.
Tube fin heat exchangers
Liquid cooled chassis and enclosures - integrated thermal and structural solutions
Rack emulator - | CDU testing and liquid cooling commissioning tool
Chillers
Pumped two-phase cooling systems for AI Processors and High-Performance Computing
Thermal control unit
Plate-fin heat exchanger
Liquid cooling loops - server cooling loop assemblies for AI data centers
Liquid cold plates - custom cold plate cooling for data centers, power electronics and EVs
Coolant distribution unit (CDU) - CDU liquid cooling for AI and enterprise data centers
Heat pipe assemblies
Immersion cooling
Thermosiphons
Air to air heat exchangers
Air-cooled chassis and enclosures
Heat sinks
Heat spreaders and conductive chassis
Thermal straps and busses
3D vapor chamber assemblies
Ultra-thin vapor chambers
Coolant distribution unit service
Logic sockets
Axial fans
Heat sink assemblies
Memory burn-in sockets
Aluminum extrusion profiles
Metal fabrication
Clean room manufacturing
Prototyping and sampling for thermal management systems
Testing and validating